O-Cresol Formaldehyde Epoxy Resin

Due to the multi-epoxy groups existed in the molecules of O-cresol formaldehyde epoxy resin,a large amount of tight cross-bonds are formed after being cured,resulting in excellent thermalstability,mechanical strength,electricity insulation and chemicals resistance.It is mainly used in microelectronic industry.Widely used for the encapsulant of semiconductors and integrated circuits

Main applications:

—microelectronic industry

—encapsulant of semiconductors and integrated circuits. 

CYDCN-200

CYDCN-205

CYDCN-205H

CYDCN-208